The main purpose of RF chips is to convert between radio waves and digital signals for processing and transmission by devices. As a key component in 5G network equipment, RF chips play a crucial role in communication systems and are widely used in various communication devices, such as 5G base stations and micro base stations.

The main structure of Guangzhou Aifo Guangtong project has been fully capped

On November 28th, the main structure of the Aifo Guangtong project invested and constructed by Science City Development Group was fully capped.

      It is reported that the Aifo Guangtong project in the Knowledge City is located in Zhongxin Knowledge City, Huangpu District, Guangzhou. The total construction area of the project is about 99785.88 square meters, and it will build a 5G filter chip production and research and development base integrating factories, R&D workshops, warehouses, etc. At present, after the main structure of the project is fully capped, it has officially entered the stage of decoration and mechanical and electrical installation, and is expected to be completed as a whole in June next year. 

source：科學城發展集團

According to the data, Aifo Guangtong is an enterprise that has mastered the core technology of 5G high-frequency body acoustic wave filter (BAW) chip preparation and key equipment, and operates in IDM mode. At present, the SABAR high-frequency bulk acoustic wave filter for Aifo Guangtong 5G is available ? The chip production line has achieved stable mass production.

Xinzhuo Semiconductor's 6-inch RF chip production capacity expansion project capped

According to the data, Wuxi Xinzhuohu Optoelectronics Co., Ltd. is a wholly-owned subsidiary of Maxscend Microelectronics Company Limited which focuses on research, development, production, and sales in the field of RF integrated circuits. It mainly provides the market with RF front-end discrete devices such as RF switches, RF low-noise amplifiers, RF filters, RF power amplifiers, and various module product solutions.

Overview of Domestic RF Chip Related Projects in 2024

In recent years, with the rapid development of 5G communication, the popularity of the RF chip industry has continued to rise. Since 2024, multiple RF chip related projects in China have disclosed their latest developments.

MEMSonics

On January 5th of this year, the official WeChat account of China Optics Valley announced that MEMSonics which is committed to manufacturing high-end RF front-end BAW filters, announced an investment of 3 billion yuan to establish its headquarters in Optics Valley and build a high-end RF filter research and development production base. After reaching full capacity, the production capacity is about 10000 pieces per month.

Newsonic Technologies

On January 20th, the groundbreaking ceremony for the Newsonic Technologies RF filter chip project was held in Suzhou High tech Zone, introducing advanced production lines for high-end semiconductor chip projects and establishing the Newsonic Technologies headquarters.

Laxcen Technology

On June 12th, Laxcen Technology's annual production of 3 billion RF chip packaging project officially started construction in Pinghu Park, Zhangjiang Yangtze River Delta Science and Technology City. The project covers an area of about 30 acres, with a total investment of 200 million yuan, a total land area of 20012.9 square meters, and a total construction area of 44358.46 square meters.

StarShine Semiconductor

On August 5th, the 5G RF filter silicon-based wafer fab project of Zhejiang StarShine Semiconductor Co., Ltd. has completed all load tests, and the single power supply has been successfully connected. The project is now ready for production line debugging.

Sappland Microelectronics

On September 20th, the launch and settlement ceremony of Sappland Microelectronics' high-performance 5G RF filter project was held at the Cloud Manufacturing Pilot Center in Tianning District, Changzhou City, Jiangsu Province. After the project is put into operation, it will achieve an annual production of over 100 million 5G RF filters.

Guobo Electronics

On November 15th, the main structure of the Guobo RF Integrated Circuit Industrialization (Phase II) project has been fully capped and has entered the secondary structure, mechanical and electrical installation, and decoration construction stages. The second phase of the project will focus on supplementing the packaging, testing, and manufacturing capabilities of RF integrated circuits. After completion, it will form a large-scale design and manufacturing capability for RF integrated circuits with the first phase.